Spectro Midex M analyser handles complex shapes

Archiv – The Midex M alloy analyser from Spectro Analytical Instruments of Kleve, Germany, features a tightly-focused X-ray beam that can be used for difficult-to-analyse surface geometries and mapping-type applications in which a number of points are analysed across a sample’s surface.The Midex M alloy analyser from Spectro Analytical Instruments of Kleve, Germany, features a tightly-focused X-ray beam that can be used for difficult-to-analyse surface geometries and mapping-type applications in which a number of points are analysed across a sample’s surface.
The Midex analyser employs energy-dispersive X-ray fluorescence (ED-XRF) technology. Its low-power, collimated X-ray beam produces a measurement spot with a diameter of 0.7 mm, enabling it to be used for virtually any non-destructive alloy-analysis task including measurement of: curved surfaces, wire and tubing; extremely small samples; high-value scrap; and the complex sample geometries found throughout the automotive, aerospace and general manufacturing industries.
The analyser comes pre-configured with the ability to conduct out-of-the-box analyses of all 80 elements from aluminium to uranium, according to Spectro. Typical measurement times are less than 2 minutes with an accuracy of typically ±0.15%, with virtually no sample preparation required.
Whereas its predecessor – the Spectro Midex – is delivered with a fixed 0.35 mm diameter collimator, the Midex M is fitted with four computer-controlled collimators with diameters of 0.1, 0.35, 0.5 and 1.0 mm. This measurement spot size flexibility allows the analyser to adapt perfectly to match the surface conditions and the size of sample area to be examined, Spectro says.
As universal analysis instruments, the Spectro Midex product family delivers fast, non-destructive analyses for a wide range of elements, claims the company. Using the newly-developed, proprietary program FP+, analysis accuracy has been improved dramatically compared to ’classic’ FP methods. In addition to bulk or particle composition analysis, instruments can also determine layer thickness quickly, accurately, and reliably. Measurement time is typically just two to three minutes.